Rohs/Weee-Compliant Dip-To-Soic Adapter

Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts. GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature PCB: 0.062 [1.58] thick FR-4 or IS410 per IPC4101A/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over Electroless Ni) MALE ADAPTOR PIN: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 MALE PIN PLATING: 10μ [0.254μ] min. Au per MIL-G-45204 over 100μ [2.54μ] min. Ni per SAE-AMS-QQ-N-290 FEMALE CONTACT PIN: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 FEMALE PIN PLATING: 10μ [0.254μ] min. Au per MIL-G-45204 over 100μ [2.54μ] min. Ni per SAE-AMS-QQ-N-290 4-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM B194-01 FEMALE CONTACT PLATING: 10μ [0.254μ] min. Au per MIL-G-45204 over 50μ [1.27μ] min. Ni per SAE-AMS-QQ-N-290 CONTACT CURRENT RATING: 3 amps OPERATING TEMPERATURE: 221°F [105°C] INSERTION FORCE: 180g/pin; based on a 0.018 [0.46] dia. test lead WITHDRAWAL FORCE: 90g/pin; based on a 0.018 [0.46] dia. test lead NORMAL FORCE: 140g/pin; based on a 0.018 [0.46] dia. test lead SOCKET ACCEPTS: leads 0.015-0.025 [0.38-0.64] in dia., 0.0100-0.125 [2.54-3.18] long MOUNTING CONSIDERATIONS SUGGESTED PCB SOLDER PAD SIZE: 0.028 [0.71] min. width